Advanced Packaging Techniques in Semiconductor Manufacturing

Semiconductor packaging is a critical aspect of device performance, impacting factors like size, power efficiency and durability. With the rise of 3D ICs and heterogeneous integration, advanced packaging techniques are reshaping the industry. This course bridges the knowledge gap between traditional and emerging packaging methods.

After completing this Pathway, you will be able to:

1. Explain the principles and methods of advanced semiconductor packaging
2. Analyze the role of packaging in improving device performance and efficiency
3. Explore the challenges in thermal management and interconnect scaling
4. Learn about the latest trends, such as chiplets and heterogeneous integration
5. Interpret knowledge through case studies of advanced packaging applications