Semiconductor Failure Analysis and Reliability

This course focuses on the principles and methodologies used in semiconductor failure analysis to ensure device reliability. Topics covered include root cause analysis, defect characterization and non-destructive testing techniques such as X-ray and electron microscopy. Learners will also explore the impact of environmental factors, including temperature, humidity, and mechanical stress on semiconductor performance

After completing this Pathway, you will be able to:

1. Identify key failure mechanisms in semiconductor devices
2. Learn the methodologies for conducting root cause analysis
3. Explain about advanced diagnostic tools like SEM and FIB
4. Apply failure analysis techniques to improve device reliability
5. Practice practical knowledge from real-world failure analysis case studies